Since its launch, GDDR6 memory has undergone major improvements that have, over time, doubled its performance and capabilities. Last July, Samsung developed 24Gbps GDDR6 memory, the industry’s fastest graphics DRAM for GPUs (Graphic card).
GDDR6W doubles that bandwidth and capacity, but is still the same size as GDDR6. Because their size doesn’t change, new memory chips can easily be fed into the same production processes as those used for today’s GDDR6.
And what is this new RAM for? To bring virtual reality closer to the real world: the metaverse. To meet this growing market demand, Samsung Electronics has developed this GDDR6W, which will go to the new GPUs and graphics cards.
GDDR6W builds on Samsung’s GDDR6 (x32) products by introducing Fan-Out Wafer-Level Packaging (FOWLP) technology, which dramatically increases bandwidth and memory capacity. this new architecture it is revolutionary.
GDDR6W Technical Specifications
As shown in the image, by being able to pack twice as many memory chips in an identically sized package, Graphics DRAM capacity has increased from 16 GB to 32 GB, while the bandwidth and number of I/Os has doubled from 32 to 64.
In other words, the area required for memory has been reduced by 50% compared to previous models. Typically, the size of a package increases as more chips are stacked.
But there are physical factors that limit the maximum height of a package. Also, while chip stacking increases capacity, there is a tradeoff to this architecture in the form of heat dissipation and performance.
To overcome these drawbacks, Samsung applied FOWLP technology to GDDR6W memory. This FOWLP technology directly mounts the memory die on a silicon wafer, instead of a printed circuit board.
In doing so, it applies RDL technology (redistribution layer), allowing for much finer wiring patterns. Also, since there are no PCBs, the thickness of the package is reduced and heat dissipation is improved. will introduce Intel this memory on your Arc graphics cards?
The height of the FOWLP-based GDDR6W is 0.7mm, which is 36% thinner than the previous package, with a height of 1.1 mm. And even though the chip is multi-layered, it still offers the same thermal properties and performance as today’s GDDR6.
The new GDDR6W technology can support level bandwidth HBM, which was the most powerful so far (AMD has been using it for years in its high-end cards, while NVIDIA has always used normal GDDR). The new generation will carry this new memory.