Rumors are confirming the next-generation chips that will power the iPhone 17 Pro and Pro Max next year. Apple has reportedly reserved all of TSMC’s 2nm processor production capacity, but manufacturing them is expected to be complex. However, non-Pro models are unlikely to benefit from the new engraving finesse.
An unprecedented level of engraving finesse
After introducing 3nm chips on the iPhone 15 Pro and improving it on the iPhone 16 this year, Apple is aiming for even thinner in 2025. The foundry TSMC has already presented prototypes of its “N2” chips (for 2 nanometers) to its biggest customers, including Apple.
Test production is even said to have started 3 months ahead of schedule in the 3rd quarter at the Baoshan plant. The aim is to ensure stable yields before mass production. Because this unprecedented engraving finesse represents a real challenge.
While TSMC has mastered the manufacturing of these 2nm chips, it needs the help of other suppliers to package them before their integration into devices. Materials, equipment, chip design, automation… It’s an entire ecosystem that must cooperate closely.
This “group fight” is crucial to stay ahead of the miniaturization race against Samsung and Intel. 2nm chips will enable significant gains in performance and energy efficiency.
Exclusive to Pro models?
But given the complexity of production, 2nm chips could be reserved for the iPhone 17 Pro and Pro Max only if Apple continues its differentiation strategy. This would therefore be the return of the reuse of old-generation SoCs on the less high-end iPhone models to further increase the average basket.
The iPhone 17 Air or ultra-thin Slim model mentioned by some rumors would therefore not benefit from it. The non-Pro versions would keep a chip engraved in 3 nm.
Successfully integrating these new chips will be a major challenge for the 2025 iPhones. Apple is betting big on this technological breakthrough, but the production challenges are on a par with the promises. Answer in a year!
